Patent-Pending In-Situ Sand Consolidation CHEMICAL TECHNOLOGY
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SandBOND™ produces an in-situ metallic bonding oxidization reaction promoting grain-to-grain sand bonding in the near-wellbore zone. ​It's designed to only bond under bottomhole conditions.
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Key Features:

  • Requires no closure stress

  • Works as low as 60 F with no upper-temperature limit

  • 100% Polymer-free 

  • Maintains original conductivity and permeability


Applications:

  • Frac sand flowback control

  • Unconsolidated sand formation

  • Unconsolidated formation undergoing steam injection

 SandBOND™ Maintained Original Conductivity and Permeability in a

 Third-Party Testing

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Test Conditions:150 0F, 24 hr, 2% KCl & 2.0 lb/ft2